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• 2.05.6 <br />(b)(i) A plan for control of surface and ground wafer drainage. <br />As`explairied, ~in (a)(i)~.above,~, (ive„isedlmentatlonz~;ponds have; ,ligen <br />constructed to control surface water drainage through the surface facilities <br />area. Other surface drainage from the permit and adjacent areas is allowed <br />to flow through ephemeral channels unimpeded by the mining operation. <br />Ground water drainage concerns are isolated to potential mine discharge. <br />This ground waterdrainage, if any, will be treated in underground sumps and <br />discharged to the surface in accordance with NPDES permit requirements. <br />(b)(ii) A plan for treatment and for surface and ground water drainage. <br />Surface run-off from the facilities area should not require treatment, other <br />than detention time provided bythe sedimentation control ponds ortreatment <br />with alternative sedimentation control. Mine discharge will be treated in <br />underground sumps if required. <br /> <br />~~ <br />PR-06 <br />2.05 - 70 - 07/01 <br />!a PPRov~D <br />~~/ 5 /O l <br />