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Banks and Gesso, LLC <br />Slope Stability Analysis <br />This report describes the analysis to support mining within the 200 foot setback, per <br />DMG Rule 6.4.19(b). The existing structures in the mine vicinity are power poles, buried <br />cables, county roads, and natural gas pipelines. <br />Background Data <br />Borehole logs indicate that the site comprises an upper overburden layer of material, <br />including topsoil, that extends to a depth of three feet, underlain by a layer of sand and <br />gravel approximately 23 feet thick. Below the sand and gravel layer is bedrock. <br />The soil survey for the area indicates that the upper layer of material within the proposed <br />permit area consist of four soil types including Altvan loam, Aquolls and Aquents, <br />Bankard sandy loam and Dacono clay loam. The engineering classification for these <br />materials are low plasticity silts and clays (CL and ML) with 50% to 75% of the material <br />passing the no. 200 sieve. <br />Soils testing has not been completed for the Heit Property, thus no site-specific soils <br />properties are known. Soil properties have been assumed based on research and <br />knowledge of properties of similar materials. Conservative values have been assigned <br />to the materials and are presented in the following table. <br />Soil Type Dry Unit Weight <br />(pct? Effective Cohesion, C (psf) Effective Friction <br />Angle, F (degree) <br />Overburden 115 200 20 <br />Sand And Gravel 120 0 30 <br />Bedrock NA NA NA <br />Mining will begin at the southeast part of the site and proceed north and west. The <br />sideslopes at the property boundaries and around structures will be mined to <br />0.5Horizontal:lVertical (0.5:1) and backfilled to the reclamation slope of 3:1/2:1. The <br />slope will be at 3:1 from ground surface to ten feet below proposed water surface upon <br />reclamation (the water surface is expected to be 3 feet below existing grade, therefore <br />Heit Sand and Gravel Mine <br />SW Meadow, LLC <br />02044 <br />February 2003 <br />30 <br />