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2016-04-25_GENERAL DOCUMENTS - C1982057 (19)
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2016-04-25_GENERAL DOCUMENTS - C1982057 (19)
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Entry Properties
Last modified
8/24/2016 6:21:07 PM
Creation date
4/26/2016 2:26:16 PM
Metadata
Fields
Template:
DRMS Permit Index
Permit No
C1982057
IBM Index Class Name
General Documents
Doc Date
4/25/2016
Doc Name
Amended Interim Order Authorizing Debtors to Obtain Post Petition Financing Pursuant to 11
From
United State Bankruptcy
To
DRMS
Permit Index Doc Type
General Correspondence
Email Name
MPB
JRS
JHB
Media Type
D
Archive
No
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Case 16-42529 Doc 149 Filed 04/15/16 Entered 04/15/16 16:16:59 Main Document <br />Pg 25 of 71 <br />Secured Agreements, including, in each case, without limitation, for lender liability or pursuant <br />to section 105, 510, 544, 547, 548, 549, 550, or 552 of the Bankruptcy Code, applicable non- <br />bankruptcy law or otherwise; (b) attempts to modify any of the rights granted to the DIP <br />Lenders, the DIP Agent; (c) attempts to prevent, hinder or otherwise delay any of the DIP <br />Lenders' or the DIP Agent's assertion, enforcement or realization upon any Collateral in <br />accordance with the DIP Documents and the Final Order other than to seek a determination that <br />an Event of Default has not occurred or is not continuing; or (d) paying any amount on account <br />of any claims arising before the commencement of the Cases unless such payments are approved <br />by an order of the Court. <br />(d) For the avoidance of doubt and notwithstanding anything to the contrary <br />herein or in the DIP Documents, the Fees Carve -Out shall be senior to all liens and claims <br />securing the DIP Documents (except with respect to claims of the Bonding Facility L/C Issuer to <br />amounts held in the Bonding Facility Letter of Credit Account and with respect to the claims of <br />the L/C Facility L/C Issuer to amounts held in the L/C Facility Letter of Credit Account (as such <br />terms are defined in the DIP Credit Agreement)), the Adequate Protection Liens, the Adequate <br />Protection Obligations, and any and all other liens or claims securing the DIP Facilities. <br />(e) For purposes hereof, the "Bonding Carve Out" is a carve -out from the <br />Collateral entitling certain governmental authorities that are or would be beneficiaries of surety <br />bonds, letters of credit or other financial assurances (each, a "Bonding Beneficiary") making <br />any demand, request or requirement for any surety bond, letter of credit or other financial <br />assurance pursuant to applicable law, in each case, to the extent such surety bond, letter of credit <br />or other financial assurance is to satisfy or replace an amount for which a Debtor is self -bonded <br />(a "Bonding Request") to receive a claim (a "Bonding Superpriority Claim") having priority <br />25 <br />
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